双面沉金板,
板厚:0.25mm,手机按键Double-sidelmmersion Gold Board,Board Thickness:0.25mmSelf Phone
软硬结合板层数:8层
板子厚度:2.0mm
材质:S1000-2M+SF202
表面处理:ENIG 2u”
盲孔:L7-L8
十二层沉金板(BGA)板厚:1.6mm,通讯设备Twelve-Layerlmmersion Gold Board,BoardThickness:1.6mmConmunication Equipment
八层半孔沉金板,板厚:2.0mm,手机连接器Eight-Layer Half-holelmmersion Gold Board,Board Thickness:2.0mmSelf Phone