十二层沉金板(BGA)板厚:1.6mm,通讯设备Twelve-Layerlmmersion Gold Board,BoardThickness:1.6mmConmunication Equipment
板材:FR4 TG170
板厚:1.6mm
表面处理:沉金
八层半孔沉金板,板厚:2.0mm,手机连接器Eight-Layer Half-holelmmersion Gold Board,Board Thickness:2.0mmSelf Phone
双面沉金板,板厚:0.25mm,手机按键Double-sidelmmersion Gold Board,Board Thickness:0.25mmSelf Phone