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| ITEMS项目 | Paramerers参数(括号内为公制) | Remarks 备注 | ||
|---|---|---|---|---|
| Double side/ulti-layer双面板以及多层板 | ||||
| max panel size 最大拼版尺寸 | 32"x20"(800mmx508mm) | |||
| innerlayer line width/space(min)内层最小线宽/线距 | 4mil/4mil(100um/100um) | |||
| mmin innerlayer pad 最小内层焊盘 | 5mil(0.13mm) | Pad annular 指焊环宽 | ||
| min core thickness 最薄内层厚度 | 4mil ( 0.1mm) | |||
| thickness ofinnerlater copper内层铜箔厚度 | 1/20z(17um) | No Cu Clad不含铜箔 | ||
| thickness of outerlayer base copper外层底铜厚度 | 1/20z(17um) | |||
| thickness offinished panel 完成板厚度 | 0.20-4.0mm | |||
tolerance offinished panel thickness 完成板厚度公差 | Thickness 板厚<1.0mm | ±12% | 4-8layers4-8层板 | |
1.0mmsThickness 板厚<2.0mm | ±8% | 4-8layers4-8层板 | ||
| ±10% | >10rayers 10层板 | |||
| Thickness 板厚>2.0mm | ±10% | |||
| surface treating process ofinnerlayer 内层表面处理工艺 | Brown Oxide棕氧化 | |||
| layer count 层数 | 2-18 | |||
| registration ofinnerlayer to ofinnerlayer 多层板层间对准度 | ±3mil(±76um) | |||
| min drilling diameter 最小钻孔孔径 | 0.15mm | |||
| min diameter of finished hole 最小完成孔径 | 0.10mm | |||
| accuracy of hole position 孔位精度 | ±2mil(±50um) | |||
| tolerance of drilled slot 槽孔公差 | ±3mil(±75um) | |||
| tolerance of PTH diameter 镀通孔孔径公差 | ±2mil(±50um) | |||
| tolerance of NPTH diameter 非镀通孔孔径公差 | ±1mi(±25um) | |||
| max A.R.OfPTH 孔电镀最大纵横比 | 10:1 | |||
| PTH hole copper thickness 孔璧铜厚度 | 0.4-2mi(10-50um) | |||
| image to image tolerance 外层圆形对位精度 | ±3mil(0.075mm) | |||
| outer layer line width/space(min) 外层最小线宽/线距 | 3mi/3mil(75um/75um) | |||
| tolerance ofetching 蚀刻公差 | ±1mil(±25um) | |||
| thickness ofsolder mask 阻焊剂厚度 | line end 线顶 | 0.4-1.2mi(10-30um) | ||
| line Comer 线拐角 | ≥0.2miLi(5um) | |||
| on Substrate 基材上 | ≤完成厚度+1.2mi(完成铜厚+30um) | |||
| hardness of solder mask 阻焊剂硬度 | 6H | |||
| solder mask registration tolerance 阻焊圆形封位精度 | ±2mil(±50um) | |||
| min solder mask dam 阻焊桥最小宽度 | 3.0mil(75um) | |||
| max solder mask plug hole diameter 塞油最大孔径 | 0.8mm | |||
| surface freatment 表面处理工艺 | HASL、播指镀金、全板键金、OSP、ENIGHASL | |||
| max nickel thickness of gold finger 金手指最大镀镍厚度 | 280u"(7um) | |||
| mak gold thickness of gold finger 金手指最大镀金厚度 | 60u"(1.5um) | |||
| range of nickel thickness for eleciroless nickel and immersion gold 沉镍金镍层厚度范围 | 120u"/240u"( 3um/6um) | |||
| range of gold thickness for electroless nickel and immersion gold 沉镍金金层厚度范围 | 2u"/6u"(0.05um/0.15um) | |||
| impedance control and tolerance 阻抗控制及公差 | 50Ω+10% | |||
| peel strength of line 线路抗剥强度 | ≥61B/in(≥107g/mm) | |||
| warp and twist翘曲度 | ≤0.5% | |||
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