八层阻抗板,板厚:1.6mm,测试仪器主板Eight-LayerDependence-Control BoardBoard Thickness:1.6mm,Testing Machine
HDI层数:10层
板厚:1.55mm
板材:FR4 TG150
表面处理:ENIG 2U“+金手指20U”
线宽/间距:4/4mil,
特殊工艺:用树脂压配合孔填充过孔
双面喷锡板,板厚:1.6mm,液晶显示器主板Double-side HASL Board,BoardThickness:1.6mm,LCD Board
四层沉金板,板厚:1.6mm,控制器Four-Layerlmmersion Gold Board,BoardThickness:1.6mm,Control Equipment
六层喷锡板,板厚:1.0mm,PDA主板Six-Layer HASL Board,BoardThickness:1.0mm,PDA Main Board
六层喷锡+金手指,板厚:2.0mm工业电脑卡板Six-Layer G/F Board, Board Thickness:2.0mm,Industry Computer Card Board